AEgis Technologies

  • Electronics Engineer

    Job Locations US-AL-Huntsville
    ID
    2018-1735
    # of Openings
    1
    Category
    Engineering
  • Overview

    What do you get when you bring together the brightest minds and place them into an exciting, fast-paced environment that fosters intellectual growth and rewards based on impact, not tenure?

     

    You get one of the best privately held small business headquartered in Huntsville, Alabama, that provides advanced technology and expert consulting services to industries throughout the world. AEgis specializes in modeling & simulation (M&S) and micro/nanoscale technology development. Our core competencies  include simulation software and training simulators; geospatial databases; 3D models; war fighter exercise support; systems engineering and analysis; verification, validation, and accreditation (VV&A); test and evaluation support; Hardware-in-the-Loop (HWIL) and Man-in-the-Loop (MIL) simulation. AEgis' Nanogenesis Division excels in advancing cutting edge micro and nanoscale technologies from concept to deployment with applications ranging from defense to energy to biotechnology.

    Responsibilities

    AEgis Technologies is seeking a hands-on, highly motivated, junior engineer to work on the MAST-M missile program.  AEgis Technologies, working with the US Army Aviation and Missile Research and Development and Engineering Center (AMRDEC), is developing a recoverable surrogate MANPADS missile system, the Missile Airframe Simulation Testbed – MANPADS (MAST-M), capable of engaging Aircraft Survivability Equipment (ASE) while guaranteeing collision avoidance and missile recovery to insure a cost-effective non-destructive test and evaluation of the ASE. The qualified candidate will perform various technical tasks from assembling PC boards and cable harnesses to designing avionics sub-components.

     

    Responsibilities:

    • Maintain, modify, and create electronic and cabling designs
    • Assembly of SMT PC boards, cables harnesses, and missile electronic sub-assemblies
    • Perform electronic sub-assembly testing
    • Organize and maintain test data
    • Generate and update design documentation (schematics, assembly drawings, user manuals)
    • Interface with vendors (component parts, PCB, assemblies, etc…)
    • Support flight test events at various DoD test ranges.
    • FPGA firmware development and testing

     New Employee Success Factor:

    • 30 days – Complete necessary training for development tools and must have demonstrated hands on skills for soldering and cable assembly.
    • 60 days – Must have taken ownership of the system wiring and designs and demonstrate a working understanding of the system

    Qualifications

    • Bachelor’s degree or equivalent, 2-5 years of experience in relative field
    • Experience in electronics design (PCB, Software/Firmware)
    • Familiar with FPGA Firmware development (Xilinx preferred)
    • Knowledge of serial communications protocols
    • Must be hands on (basic PCB soldering (SMT), wiring, basic mechanical assembly)
    • Able to work with minimal supervision
    • Demonstrates good problem-solving skills
    • Excellent written and oral communication skills
    • Familiar with industry standard PCB and mechanical design software packages.
    • Must have an active DoD Secret security clearance

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